Quality assurance measures, process assurance, raw material control. Including the control of raw materials such as mask plates, chemical reagents, photoresists, especially silicon materials. The control not only adopts the traditional single inspection method, but also adopts statistical process control (SpC) technology for key raw materials to ensure high quality of raw materials and good quality consistency.
Control of processing equipment. In addition to using advanced equipment for process processing, daily maintenance and preventive maintenance of equipment should also be done. At the same time, key parameters of equipment should be monitored, and if necessary, an SpC control model of equipment parameters should be established for analysis and control.
Control of technological process. Including SpC control of key process parameters, process capability analysis, 6σ design, etc. At the same time, establish process inspection methods for key processes, such as pinholes and cracks in the oxide layer, movable metal ions, metal Layer stability test, etc. In addition, the technical guarantee should also include training and assessment of the operating personnel, control of environmental cleanliness and the establishment of advanced production quality management information systems.
Conventional reliability design technology. Including redundant design, derating design, sensitivity analysis, central value optimization design, etc.
Device design techniques for major failure modes. Including the main failure modes such as hot carrier effect, latch-up effect, and reasonable design of device structure, geometric parameters and physical parameters.
process design guarantee for major failure modes. Including the use of new process technology and adjustment of process parameters to improve the reliability of semiconductor integrated circuit chips.
Computer simulation technology of semiconductor integrated circuit chip reliability. Simultaneously with the circuit design, the circuit structure, layout, wiring, and reliability characteristic parameters are used as inputs to perform computer simulation analysis on the reliability of the circuit. According to the analysis results, the reliability level of the circuit can be predicted, the design rules to be adopted in the reliability design can be determined, and the reliability weak links in the circuit and layout design schemes can be found.
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